PC DEP42E,PC DFD03

详细内容：PC DEP42E,PC DFD03 金龙先生15916816001 洽谈Q Q：1362174071 PC DEP42E,PC DFD03 DEL36 Electrically Conductive,Internally Lubricated Polycarbonate compound containing PTFE, Carbon Fiber.导电.内部润滑聚碳酸酯复合含有聚四氟乙烯,碳纤维。 DEP23FXC Electrically Conductive Polycarbonate compound containing Carbon Fiber, PTFE, Silicone.导电聚碳酸酯复合含炭纤维、聚四氟乙烯、硅酮。 DEP32 Polycarbonate Carbon Fiber PTFE/Silicone Statically Conductive聚碳酸酯碳纤维聚四氟乙烯/硅胶静态导电 DEP42E Easy Molding Polycarbonate compound containing Carbon Fiber, Silicone, PTFE.容易成型聚碳酸酯复合含炭纤维、硅胶、聚四氟乙烯。 DFD03 PC, Glass Fiber, Impact Modified,PC、玻璃纤维、冲击改性, PC DEP42E,PC DFD03 HFD1711 PC Copolymer, Lexan, Mold Release, Easy Molding, Easy Release, Exceptional Processing, Heat Stabilized, Transparent, High Flow, PC共聚物、聚碳酸酯、脱模,容易成型,容易释放,异常处理、热稳定、透明、高流, HFD1731 PC Copolymer, Lexan, Mold Release, UV-stabilized, Easy Molding, Easy Release, Exceptional Processing, Heat Stabilized, Transparent, High Flow, PC共聚物、聚碳酸酯、脱模,紫外线稳定,易成型,容易释放,异常处理、热稳定、透明、高流, HFD1810 PC Copolymer, Lexan, Mold Release, Easy Molding, Easy Release, Exceptional Processing, Heat Stabilized, Transparent, High Flow, PC共聚物、聚碳酸酯、脱模,容易成型,容易释放,异常处理、热稳定、透明、高流, HFD1830 PC Copolymer, Lexan, Mold Release, UV-Stabilizer, Easy Molding, Easy Release, Exceptional Processing, Heat Stabilized, Transparent, UV-Stabilized, High Flow,PC共聚物、聚碳酸酯、脱模,紫外线稳定剂,容易成型,容易释放,异常处理、热稳定、透明、紫外线稳定、高流, HFD1910 PC Copolymer, Lexan, Mold Release, Easy Molding, Easy Release, Exceptional Processing, Heat Stabilized, Transparent, High Flow,PC共聚物、聚碳酸酯、脱模,容易成型,容易释放,异常处理、热稳定、透明、高流, PC DEP42E,PC DFD03 PC塑胶原料的吸水率较大，加工前一定要预热干燥，纯PC干燥120℃，改性PC一般用110℃温度干燥4小时以上。干燥时间不能超过10小时。一般可用对空挤出法判断干燥是否足够。再生料的使用比例可达20%。在某些情况下，可100%的使用再生料，实际份量要视制品的品质要求而定。再生料不能同时混合不同的色母粒，否则会严重损坏成品的性质。